Numerical Simulation of the Temperature on the Metallization of an Integrated Circuit and its Impact on Interconnect Lifetime

Keywords: BEOL, reliability, electromigration, integrated circuit


This paper demonstrates a finite element model to investigate the temperature change of the interconnects of an integrated circuit due to the power dissipation of the transistors in the substrate. The temperature of the local interconnect is more significantly affected, exhibiting an increase of 49 K and 34 K, for the Metal 1 and Metal 2, respectively. We discuss the impact of the temperature increase in the electromigration and, as a consequence in the lifetime of an operational amplifier, which demonstrates the importance of considering the metallization temperature distribution in the design stage.

Special Section on SBMicro2020